Cu Corrosion Test Method for Lead-Free Solders
نویسندگان
چکیده
منابع مشابه
Novel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility
Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations of tin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements hav...
متن کاملA Comparison of Lead-Free vs. Eutectic Solders
T he use of lead in the electronics industry today accounts for approximately 7% of total lead consumption.' The single largest use of lead is in the manufacture of storage batteries, which accounts for 60% of the total lead produced.2 The use of lead is closely regulated in plumbing, paint and gasoline industries. Currently, the electronics industry has been exempted from the existing requirem...
متن کاملEffects of Lead-Free Solders on Flex Performance
Ceramic capacitors have proven themselves very reliable with extremely low failure rates. As processes continue to improve, reliability of the dielectric also continues to increase. This increase in the reliability of the dielectric has caused other categories to emerge as the main contributors to the overall failure rate. A recent review of field failure analysis of surface mount MLCCs, has sh...
متن کاملKirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
In most cases authors are permitted to post their version of the article (e.g. in Word or Tex form) to their personal website or institutional repository. Authors requiring further information regarding Elsevier's archiving and manuscript policies are encouraged to visit: a b s t r a c t The reactions between Sn2.5Ag solder doped with different levels of Ni (0–0.1 wt.%) and two different types ...
متن کاملLead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects
Lead-free soldering, originally started as an environmental issue, is evolving rapidly into a business survival tool for the worldwide electronic industry. Promising lead-free solder alternatives for surface mount assembly applications include eutectic Sn/Ag, eutectic Sn/Cu, Sn95/Sb5, eutectic Sn/Bi, Sn/Ag/Cu, Sn/Ag/Cu/X, Sn/Bi/Ag/X, Sn/Zn/X, and Sn/In/Ag/(X). However, for wafer level area arra...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Welding and Joining
سال: 2017
ISSN: 2466-2232
DOI: 10.5781/jwj.2017.35.3.4